Research on LTCC-based Flat Optocoupler Assembly Technology

摘要：

　　A planar optocoupler assembly technology based on low temperature co-fired ceramic(LTCC)technology is proposed.The LED and the phototool are assembled into the LTCC substrate.The electrical interconnection is completed by the Auger ball bonding,And reflective plastic,the formation of surface-mount devices adapted to hybrid circuits.Through the application in the sample circuit,the planar optocoupler is suitable for high-density assembly,which can achieve the electrical isolation between the input and the output of the DC/DC module.

关键词： LTCC light guide glue photoelectric coupling high-density SMT

作者: ZHANG Jun Ye Xiao Fei LI Meng Lin SHI Hailin

作者单位: Xian Microelectronics Technology Institute Xian China 710119

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 841-849

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）