Thermal analysis and optimization of air trench structures for thermally tunable devices
Thermally tunable devices are important building blocks of photonic integrated circuits for optical fiber communication and sensing applications.To increase their tuning efficiency,an air trench structure has been introduced to the devices.By using finite element method,the distributions of temperature,stress and displacement of the waveguide are studied.After optimization,under the temperature rise of 70 ℃,the maximum values of temperature difference,stress and displacement are smaller than 10%of the temperature rise,allowable stress and 0.002%of the waveguide length,respectively.This optimized air trench structure is desired for thermally tunable devices reaching low power consumption,high temperature uniformity and mechanical stability.
thermally tunable device air trench structure thermal analysis
Fei Duan Kai Chen Yonglin Yu
Wuhan National Laboratory for Optoelectronics Huazhong University of Science and Technology Wuhan,China
国际会议
上海
英文
876-878
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）