Numerical simulation on wafer warpage during molding process of WLCSP

摘要：

　　As the increasing of the chip integration and adoption of large-size wafers,the warpage problem is more serious in WLCSP.Considering that the die size becomes smaller,a full finite-element model with small die-size is difficult to develop.In this paper,a quarter model and a half general plane deformation(GPD)slice model were developed through finite element method(FEM).Their warpage and stress results were compared.Influences of different material and structural parameters in molding process were investigated finally.

关键词： WLCSP warpage FEM Half-GPD model Molding process

作者: YANG Mengke QIN Fei YU Daquan

作者单位: Institute of Electronics Packaging Technology and Reliability,College of Mechanical Engineering and Huatian Technology(Kunshan)Electronics,Kunshan,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 886-890

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）