Research on Evolution Behaviors of SnPb Solder Under High Current Stressing
Microstructure evolution of the Sn63Pb37 alloy during current stressing deteriorated the reliability of solder interconnects under miniaturization trend of microelectronic devices.By decoupling inhomogeneous temperature influence in Sn63Pb37 solder joint from the current,the microstructure evolution of the Sn63Pb37 alloy was deeply studied after current stressing at 1.84 × 104 A/cm-2 for 24 h.The decomposed and recombined behaviors of the Pb-rich phase were observed in both cathodic and anodic solder matrixes,respectively.The phase segregation and phase ripening under EM were studied,and the phase ripening under aging was also studied.This research can offer experimental data to interpret acceleration tests for Sn63Pb37 solder interconnects during EM,and also can be beneficial to understand the migration behavior as well as the reliability of eutectic solder alloys.
Phase segregation Electromigration Reliability SnPb solder
Huijun Cao Zhihao Zhang Yuxi Yu
School of Mechanical and Automation Engineering,Xiamen City University Xiamen,361000,China Shenzhen Research Institute of Xiamen University,Shenzhen,518000,China;Fujian Key Laboratory of Adva
国际会议
上海
英文
891-894
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）