Interconnection Reliability for MCM of Large Micromirror Arrays and High Voltage Driving ASIC Based on High-density Substrate

摘要：

　　In this paper,the insulation performance for 2DMCM(MMA and HV-ASIC)has been presented.Firstly,the theoretical method was used to calculate and analyze the insulation resistance.Secondly,the insulation resistance of the entire packages was simulated by using COMSOL Multiphysics software.Finally,the measurement of the interline and inter-layer insulation resistance were conducted.The results showed that the inter-layer insulation resistance is higher than 300 MΩ at 100 V and 100 MΩ at 200 V,which is close to the simulation results.With the increase of line space,the inter-line insulation resistance does increase,which is consistent with theoretical calculations.When the line space is 5μm,the inter-line insulation resistance is higher than 610GΩ.

关键词： high-density interconnection micromirror arrays (MMA) insulation resistance BCB

作者: Zhenggao Hu Wei Gai Gong Cheng Weibo Zhang Yaming Wu Gaowei Xu

作者单位: State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Tech State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Tech State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Tech

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 895-898

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）