Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material
Because its low sintering temperature,high melting point,excellent mechanical reliability,high electrical and thermal conductivities,silver nanoparticle sintering has the potential to be applied in high power electronic packaging as an alternative lead-free chip attach material.In this paper,IGBT simulation model of the double-sided cooling package is built,and the different chip attach materials of traditional Sn/Ag materials and silver nanoparticle sintering materials are compared.ANSYS is applied to simulate and analyze thermal distribution of the model.Results show that the IGBT module which adopts silver nanoparticle sintering material in the same boundary conditions,and the maximum chip temperature of the module is 77.1907 ℃,14.14%lower than the traditional Sn/Ag material.This analysis can be further applied that the thermal properties of Silver nanoparticle sintering materials are better than that of traditional Sn/Ag materials.
silver nanoparticle sintering IGBT reliability finite element analysis (FEA)
Hu Wang Daoguo Yang Miao Cai Xiyou Wang Zhi Liang
Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology School of Mechanism and Electrical Engineering,Guilin University of Electronic Technology Guilin,China
国际会议
上海
英文
904-907
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）