An Exhaustive Search of the Optimal 6C Level Static Shielding Scheme for Rectangle TSV Arrays

摘要：

　　Through-silicon via(TSV)is one of the key enabling technologies of stacked 3D ICs.However,the crosstalk among the adjacent TSVs decreases the performance of TSV bus and deteriorates the signal integrity.The static shielding wire is an effective crosstalk suppression method.Till now,the systematic design method of the shielding scheme under the constraints of crosstalk severity level and size of TSV array has not been studied.This paper proposes an exhaustive search technique of static shielding scheme for the lowest system overhead.Experimental results on 6C crosstalk severity level case for the rectangle TSV arrays validate the effectiveness of the proposed technique.And the comparison results between the optimal crosstalk avoidance code(CAC)and the optimal static shielding scheme show that the system overhead of the static shielding scheme is usually higher than that of the CAC counterpart for different TSV array sizes.

关键词： TSV crosstalk static shielding wire exhaustive search system overhead

作者: Xiaole Cui Mengying Luo Qiujun Lin Min Miao Yufeng Jin

作者单位: Key Lab of Integrated Microsystems,Peking University Shenzhen Graduate School,Shenzhen 518055,China Information Microsystem Institute,Beijing Information Science & Technology University,Beijing 100101

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 944-948

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）