Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process

摘要：

　　A three-dimensional finite element analysis model of BGA components was established.Using ANSYS,this model was subjected to stress-strain finite element simulation analysis under thermal-structure coupling conditions.The influence of temperature field distribution and stress-strain during BGA solder joint reflow process was studied.The results show that the reflow soldering process of the BGA assembly is simulated,with different temperature zones,the temperature distribution of BGA solder joints is uneven and the temperature is more close to the center temperature of the Assembly,the stress and strain of the solder joint is reduced after the heat preservation zone and the Reflow area,and the stress strain will increase when the cooling zone is over.

关键词： BGA solder joint ANSYS reflow thermal stress-strain

作者: Xiang-qiong Tang Chun-yue Huang Sheng-jun Zhao Liang-kun Lu

作者单位: School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,guilin,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 981-986

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）