Thermal conductivity of epoxy resin using molecular dynamics simulation

摘要：

　　The low thermal conductivity of amorphous epoxy resin significantly limits its applications in electronics.In this paper,the thermal conductivity of cross-linked epoxy resin was investigated by Green-Kubo method.A stepwise crosslinking method was adopted to construct the molecular model.In order to verify the correlation lengths effect,four different correlation lengths are considered under the same integral time.The contributions of curing agent types and conversions towards thermal conductivity are discussed.

关键词： thermal conductivity molecular dynamics simulation epoxy molding compound

作者: Bensong PI Huiping YU Fei QIN Pei CHEN Anwen CAI

作者单位: Institute of Electronics Packaging Technology and Reliability Beijing University of Technology Beijing,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 995-998

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）