Investigation on Copper Clip Bonding Structure for Power Package

摘要：

　　In this paper,the influence of copper clip package on thermal stress of power devices is studied.The effects of die thickness,clip thickness,solder thickness,and PCB thickness on the thermal stress were analyzed by finite element model.Response surface methodology and design of experiment(DoE)are exploited to optimize package design and obtain an analytical formula of thermal stress of the solder layer which is the weakest part of the package.Based on the analysis,a copper clip package design with slot design is proposed to reduce the thermal stress.The experimental results show that the slot structure contribute to the release of the planar circumferential stress,and the thermal stress of the solder layer is reduced.

关键词： Copper Clip Bonding Slot Structure Response Surface Method Design of Experiment(DOE)

作者: Linqi Liu Qiang Liu Xiaoyong Miao Wei Jiang Wei Lin Lei Shi

作者单位: Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology Department of Miccroelectro Tongfu Microelectronics Co.,LTD Nantong,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1042-1046

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）