Laser Grooving Technology Study at Dicing Process in Wafer Level Package
The mechanical strength of low dielectric constant interlayer dielectric film(low-k layer)materials is lower.In the future,the low-k layer will continue to advance the dielectric constant and reduce the material elasticity,with the development of the wafer foundry technology,more and more low-k material have been used in the wafer manufacture which caused the topside layer of the wafer become more and more crisp,it is more easier caused the peeling and topside chipping issue during the dicing process,so the blade saw is not applicable for this product,laser grooving technology is as a matter of course to develop.This study is to show the laser grooving application at the wafer saw process,setup DOE study on the key parameters,laser power,frequency and feed speed,to verify and get the best result.
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Chao Chen Ming Li Kenny Cao
School of Materials Science and engineering,Shanghai Jiao Tong University Shanghai,China;No.78 Chang School of Materials Science and engineering,Shanghai Jiao Tong University Shanghai,China Jiangyin Changdian Advanced Packing CO.,LTD
国际会议
上海
英文
1055-1058
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）