A novel interposer fabrication method for integration of bandpass filter applied in high frequency

摘要：

　　The passive silicon interposer based 3D IC integration technology is a promising method to realize the integration of passive components and CMOS ICs.In this paper,a novel fabrication method for the 3D integration of bandpass filter is presented.A new through-silicon-vias transmission structure,which contains six shielding TSVs and one signal TSV,was applied in transmission structure to reduce the substrate loss.A bandpass filter working in the range of 8-12GHz was integrated with the interposer by means of wafer level Cu/Benzocyclobutene thin film process.The advantages and the potential application of the integration was discussed.

关键词： system in package 3D integration through silicon via interposer high frequency application

作者: Weibo Zhang Gaowei Xu Le Luo

作者单位: State Key Laboratory of Transducer Technology Shanghai Institute of Microsystem and Information Tech State Key Laboratory of Transducer Technology Shanghai Institute of Microsystem and Information Tech

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1075-1078

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）