Effects of Current Density and Concentration of Sn2+on Solder Voids
For the solder balls used in advanced filp-chip technology,SnAg is one of the most promising materials to replace the conventional SnPb solder which is harmful to environment.During the two-step electroplating process of SnAg solder,the divergence of electrode potential between Sn2+and Ag+often leads to the appearance of undesirable voids.Two decisive parameters that play an important role on solder voids,current density and concentration of Sn2+,were evaluated in this paper.The results of X-ray observation suggested that relatively lower current density and higher concentration of Sn2+would help to reduce the voids and then improve reliability.In addition, a simple mechanism of the effects of current density and concentration of Sn2+on void formation was proposed,which provided guidance for industrial production.
SnAg Solder Solder Voids Current Density Concentration of Sn2+ X-ray
Liang Guo Ming Li Li Zhang
School of Materials Science and engineering Shanghai Jiao Tong University Shanghai,China Technical V.P.Jiangyin Changdian Advanced Packing Jiangyin,China
国际会议
上海
英文
1089-1091
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）