Numerical study on a novel microchannel structure towards high efficient heat dissipation in high power electronics
With the increasing heat fluxes of IC chips,the traditional rectangular microchannel almost reaches the limits to meet the requirements.It is significant to propose optimized structure or other enhanced heat transfer mothed to improve the heat dissipation in the limited space.In this study,a three-dimensional conjugate numerical simulation model has been conducted to analyze the flow and temperature characteristic of proposed silicon-based rectangular microchannel structures.It was found that the microchannel with the front loose back compact configuration(FLBC)of internal spoiler cavities presented the optimal flow and heat transfer performance,which was furtherly improved as the increases of Re.Additionally,the pressure drop of the microchannel sustained approximate identical given that the number of internal spoiler cavities was kept the same.In terms of thermal performance,lower temperature and better uniform temperature characteristic of the microchannel with FLBC were obtained comparing with that using traditional rectangular microchannel with the same number of internal spoiler cavities.It was believed that the presented method could pave a way for thermal management in high heat flux electronic devices.
high heat flux devices thermal management microchannel heat sink enhancement heat transfer
Fang Li Wenhui Zhu Hu He
School of Mechanical and Electrical Engineering,Central South University,Changsha 410083,China State Key Laboratory of High Performance Complex Manufacturing,Central South University,Changsha 410
国际会议
上海
英文
1145-1148
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）