Study on the SnAgCu solder joint between LED chip and heat sink
The solder-bonded joint is an important cooling channel of the LED device.The quality of the welding interface would determine the thermal resistance and heat capacity.The SnAgCu solder joints were studied under different reflowing processes,and the microstructure and composition of SnAgCu solder joints were investigated by SEM and associated analysis.After the SnAgCu solder join was reflowed at 240℃ for 6s,a thin layer of IMCs were formed at the solder-bonded interface,and some tiny voids were formed at the solder joint.After the SnAgCu solder join was reflowed at 260℃ for 6s,the interfacial IMCs would grow together and almost cover the total interface.If the reflow temperature was too high,the excessive growth of IMCs would decrease the reliability of the solder joint.
LED packaging solder joint die bonding interfacial compounds
W.Liu X.X.Qian J.T Lin
Xuyu Optoelectronics(Shenzhen)Co.,Ltd;Shenzhen Earlysun Technology Co.,Ltd Shenzhen,China Shenzhen Earlysun Technology Co.,Ltd Shenzhen,China Xuyu Optoelectronics(Shenzhen)Co.,Ltd
国际会议
上海
英文
1174-1177
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）