会议专题

Scaling Optical Communication for On-Chip Interconnect

  In the high-density integrated circuits of the future,electrical wires may reach their performance limits for intrachip device connections.One possible solution to this problem is a transition to on-chip optic communication.Optic technologies present many benefits for on-chip interconnection systems,but they also bring challenges in their implementation.In this paper,research of on-chip optical communication is reviewed as a means of meeting the growing demands of IC interconnects.Optical systems and devices are evaluated as they scale down to global and intermediate level chip interconnections.

optical interconnections on-chip communication global interconnect optoelectronic devices system scaling modulators photodiodes waveguides wavelength division multiplexing

Mat Binggeli Feng Li

ON Semiconductor Pocatello,Idaho,United States Department of Electrical and Computer Engineering University of Idaho Moscow,Idaho,United States

国际会议

第十九届国际电子封装技术会议(ICEPT 2018)

上海

英文

1178-1183

2018-08-08(万方平台首次上网日期,不代表论文的发表时间)