A Packaged 2×2 Switch Array for Power Handling and Isolation Improvement

摘要：

　　This paper presents a packaged 2×2 dc-contact Radio Frequency Micro-Electro-Mechanical Systems(RF MEMS)switch array.The 2×2 switch array shows higher power handling ability compared with 1×1 switch and higher isolation compared with 2×1 switch array.Packaging process was implemented in a wafer level packaging(WLP)method using adhesive benzocyclobutene(BCB)bonding.The insertion loss and isolation of packaged switch are better than-1 dB and-20 dB @ 30 GHz.And the lifetime of packaged switch is over 1 million cycles under cold-switching condition with 400 mA dc power.Furthermore,the switch could deal with a maximum power of 1.5 W @ 10 GHz for 2 hours when the switch remains hold-down condition.

关键词： RF MEMS Switch Array Power Handling Isolation Package

作者: Yulong Zhang Zhuhao Gong Xin Guo Zewen Liu

作者单位: Department of Microelectronics and Nanoelectronics,Tsinghua University Beijing,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1189-1192

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）