Recent Advances in 3D Packaging for Medical Applications
This paper discusses recent advances in 3D packaging for medical applications.Specifically,the paper focuses on how 3D packaging technology can promote the development of modern medical applications.Different types of 3D packaging technologies,including Chip-on-Chip(CoC),Package-on-Package(PoP),Wafer-on-Wafer(WoW),and the new Package-interposer-Package(PiP)technology will be reviewed systemically.The 3D packaging applications to medical equipment such as remote monitoring,and therapeutic medical devices including implantable devices will be discussed respectively.To follow the trend of miniaturization of medical devices and enable the advanced diagnostic and therapeutic methods,3D packaging will be used widely in modern medical applications.3D packaging can help the medical devices like sensors reach small enough size and very thin thickness to adapt to complex and harsh environment like human body.Apart from this,medical devices with 3D packaging integration technology has higher accuracy and efficiency.Values can be added by incorporating functionalities cost effectively to a medical system integration requirement.It is proven that the 3D packaging technology is going to have a more promising future in medical applications.
3D packaging system-in-package(SiP) singlechip packaging(SCP) medical device sensor MEMS Parylene C
Yi Yang Feng Li
Department of Electrical and Computer Engineering University of Idaho Moscow,Idaho,United States
国际会议
上海
英文
1193-1197
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）