会议专题

Preparation and Characterization of Al2O3-AgNP hybrids for Application in Thermally Conductive Polymer Composites

  With the fast development of the integrated circuit towards high density,miniaturization,multifunctionalization,heat management become one of the top priority issues to be addressed.Owing to excellent physical and chemical properties,especially excellent flexibility,polymers have wide applications in electronic.Nevertheless,most polymers possess thermal conductivity below 0.5 W/mK,which cannot meet the requirement in modern electronics with high power density and high speed.Conventionally,thermally conductive fillers are used to enhance the polymers thermal conductivity.Unfortunately,the enhancement of thermal conductivity is limited even at the high-volume fractions of filler(50%in volume).Herein,we report on an effective approach to preparing Al2O3-AgNP hybrids liquid-phase chemical reduction method.The Al2O3-AgNP hybrids consist of silver nanoparticles(AgNP)decorated aluminum oxide(Al2O3)microball.The structure and morphology of Al2O3-AgNP hybrids were confirmed.We demonstrated that the Ag nanoparticles with the size of 40-50 nm were uniformly decorated on the Al2O3 surface,and the amount of Ag nanoparticles also can be tunable.We believe that this method has potential in preparing Al2O3-based polymer materials for application in thermally conductive polymer composites.

Thermal management Thermally conductive fillers Aluminum oxide Silver Hybrids

Linlin Ren Xiaoliang Zeng Rong Sun Jianbin Xu Ching-Ping Wong

Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences Shenzhen,China Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences Shenzhen,China;Department of

国际会议

第十九届国际电子封装技术会议(ICEPT 2018)

上海

英文

1205-1208

2018-08-08(万方平台首次上网日期,不代表论文的发表时间)