Model and Analysis of Planar Spiral Inductor Based on Package Substrate

摘要：

　　This paper presents the planar spiral inductor structure modeled by ANSYS HFSS.Meanwhile,footprint of spiral inductors is manufactured to validate the simulated results.Scattering parameters are utilized to extract L and Q to compare the simulation results with measured data.While changing the geometric parameters such as the metal width(w),spacing between traces(s),the number of turns(n),and inner diameter(din),varies in the performance of spiral inductors are detailedly analyzed.By using the technology of planar spiral inductors,a novel chip-package co-design method is optimized for low noise amplifier(LNA)application.

关键词： planar spiral inductors geometric parameters package substrate

作者: SUN Haiyan SUN Wenjun SUN Ling ZHAO Jicong FANG Jiaen MIAO Xiaoyong WANG Honghui

作者单位: Jiangsu Key Laboratory of ASIC Design Nantong University Nantong,China U-pkg Technologies Co.,Ltd Chengdu,China Tongfu Microelectronics Co.,Ltd Nantong,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1227-1231

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）