Molecular dynamics study of copper wire bonding process

摘要：

　　The function of integrated circuit(IC)packaging is to supply power path,signal path,heat dissipation path,mechanical support and environmental protection for a chip.Bonding wires are the bridges between the chip pads and the inner leads of leadframe.So the bonding quality directly affects the electrical performance of a packaging,it is necessary to understand the wire bonding process in depth.In this paper,the molecular dynamics method is used to study the microstructure evolution of Cu/Al bonding interface for copper wire bonding.

关键词： Wire bonding Molecular dynamics Cu/Al bonding

作者: Xiyou Wang Daoguo Yang Zhangping Yang Lei Wang

作者单位: College of Mechanical and Electrical Engineering Guilin University of Electronic Technology Guilin,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1312-1316

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）