Investigation on highly efficient thermal interface materials:a new attempt to bond heat-conducting particles using low-melting-temperature alloy

摘要：

　　A thermal interface material(TIM)with high thermal conductivity and excellent flexibility is present using a special process.In our method,the low-melting-temperature alloy(LMTA)is used to produce metallurgical bonding between heat-conducting particles.Then the foaming agent is brought in material preparation to build a uniform inter-connective porous structure throughout the composite,and afterwards,organic silicone resin will completely fill the matrix above in a vacuum.After curing,the silicone resin can offer necessary restriction for leak problem of LMTA,meanwhile,the composite material can also absorb shock and provide optimum bonding with contact surfaces.

关键词： thermal interface materials low-melting-temperature alloy Ti-coated diamond particles

作者: Song Wei Li-Jun Zhou Jing-Dong Guo

作者单位: Institute of Metal Research,Chinese Academy of Sciences,Shenyang,110016,China;School of Materials Science and Engineering,University of Science and Technology of China,Shenyang,110016,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1333-1336

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）