Analysis and optimization of coupling noise in TSV array
In this paper,in order to further reduce the electromagnetic crosstalk of the TSV array,we proposed a layout of TSV array which the differential signal TSVs are interleaved with the ground TSVs due to the excellent noise suppression of the shielded ground TSV and differential signals compare with the traditional layout of TSV array.Since the spacing between the differential signals used in this paper is half of the single-ended signal,this structure can reduce the coupling noise between the signals by 60%without increasing the silicon substrate area.In addition,we proposed a twisted chain structure based on the differential interleaved layout for the multi-layer substrate stacked.From the results of full-wave electromagnetic field simulation software,it can be seen that the coupling noise can be reduced by up to 25%,which proves the superiority of the proposed structure.
through silicon via (TSV) coupling noise differential signal array layout optimization
Zheng Mei Gang Dong Weijun Zhu Jingrui Chai Junping Zheng Dongliang Song
School of Microelectronics Xidian University Xian City,Shaanxi Province,P.R.China
国际会议
上海
英文
1337-1342
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）