Application of Three-Dimensional X-Ray Microscopy in Failure Analysis for Sealed Relay
Sealed relay as a kind of switch component is widely used in communication,control and power protection system because of its mature process,convenient application.The sealed relays reliability becomes the focus,which affect the quality and reliability of the whole electronic system.In order to improve the reliability of sealed relay,failure analysis and destructive physical analysis are more and more important.Nowadays,three-dimensional(3D)X-ray microscopy as a non-destructive method is extensively applied in failure analysis of electronic components.In this paper,the principle of 3D X-ray microscopy and the common failure modes of sealed relay were introduced briefly.Moreover,the application of 3D X-ray microscopy in failure analysis for sealed relay was presented.The internal structure of sealed relay could be reconstructed by 3D X-ray microscopy and the abnormity would be located according to the structural contrast,which lay the foundation for the failure location.
Three-dimensional (3D) X-ray microscopy Sealed relay Failure analysis
Daotan Lin
Reliability Analysis and Research Centre China Electronic Product Reliability and Environmental Testing Research Institute(CEPREI),Guangzhou,China
国际会议
上海
英文
1351-1354
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）