Effect of In addition on the properties of Sn-Au-Cu lead-free solder

摘要：

　　In order to improve the mechanical properties of Sn-Au-Cu solder,Indium was added into Sn-Au-Cu solder and five kinds of Sn-Au-Cu-In solders were designed based on cluster-plus-glue-atom(CPGA)model and the melting properties,microstructure,wettability,interfacial reaction and mechanical properties were studied systematically.The DSC results showed that the addition of In reduced the melting point of the Sn-Au-Cu-In solder.The microstructure of Sn-2.85Au-2.34Cu-0.65In solder consisted of white AuSn4 phase,little Cu6Sn5 phase and gray β-Sn matrix,while the other 4 solders consisted of white Au(Sn,In)4 phase,little Cu6Sn5 phase and gray β-Sn matrix.The wettability of five solders on Cu substrate were better than those on Ni substrate.The wettability of Sn-2.81Au-0.89Cu-3.21In solder on Cu substrate was the best; while that of Sn-2.85Au-2.34Cu-0.65In solder on Ni substrate was the best.The shear strength of Sn-2.85Au-2.34Cu-0.65In solder joint was 72 MPa,which was the highest among the five solders.

关键词： Sn-Au solder Sn-Au-Cu-In microstructure mechanical properties cluster-plus-glue-atom model

作者: Siqi Yin Mingliang Huang Yu Chen

作者单位: Electronic Packaging Materials Laboratory,School of Materials Science & Engineering Dalian University of Technology Dalian,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1363-1367

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）