Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects
The effect of sequential soldering and initial Cu concentration in solders on the interfacial reaction,especially the morphology,growth of IMC and Cu consumption,were investigated by using 300-μm(diameter)various composition of solder balls and substrates with a 250-μm(diameter)opening of OSP and ENIG pads.Two paths were employed.For path I,a solder ball was first joined to the Cu substrate and then to the Ni substrate.For path Ⅱ,the sequence was the opposite.Main IMCs found at the interfaces on both sides were Cu6Sn5 and(Cu,Ni)6Sn5 for interconnects via path I,while for path Ⅱ,IMCs on Ni side affected the interfacial reaction on Cu side with a novel(Cu,Ni)6Sn5 bedded IMCs morphology.A mechanism was introduced to illustrate the phenomenon.In addition,the thickness of IMCs and Cu consumption depended on soldering sequences and initial Cu concentration in solders.
sequential soldering Sn-Cu-Ni initial Cu concentration Ni diffusion cross-solder interaction
Jiameng Kuang Mingliang Huang
Laboratory of Electronic Packaging Materials,School of Materials Science and Engineering,Dalian University of Technology Dalian,China
国际会议
上海
英文
1368-1371
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）