The Study of Thermally Induced Warpage of BGA Package during Reflow Soldering
Currently,Ball Grid Array(BGA)package is becoming the most wildly used semiconductor packaging type.When BGA packages are subject to elevated temperatures during reflow soldering,warpage,or shape deformation occurs.Many solder joint failure modes may be caused by warpage,such as bridging,non-wetting and stretched-joint etc.In this paper,we tried first to characterize the BGA package warpage with shadow moiré method.Based on such studies,warpage of BGA packages with different dimension,material(plastic or ceramic)and heat dissipation way during lead-free reflow soldering was measured,as a result,the law and influence factor of BGA package warpage were revealed and investigated.The warpage of PBGA package were also studied by finite element simulation in this paper.Finally,a case study of BGA solder joint failure was introduced and the effect of packages warpage on BGAs solder joint interconnection was studied.
BGA package Warpage Shadow moire Solder joint failure
Yao Bin Wang xiaofeng Zou Yabing
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory CEP Reliability Research and Analysis Center CEPREI Guangzhou,China
国际会议
上海
英文
1411-1414
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）