Effect of LED Chip Displacement on its Optical Performance and Reliability

摘要：

　　The displacement of the LED chip can easily occur during chip bonding process,which is the first step of LED packaging.In this work,the effect of LED chips displacement was studied by theoretical analysis and a series of comparative experiments,and the effects include LEDs optical performance and reliability.LED modules with different chip displacement distances were packaged.The optical parameters were measured and accelerated aging tests were conducted to estimate the LED modules reliability.The degradation curves of luminous power were fitted and the lifetimes were predicted.It was found that the chip displacement can greatly affect the optical performance and reliability of LED modules.Finally,some possible methods to eliminate the effect were brought up.

关键词： LED chip displacement accelerated aging test reliability

作者: Naiqi Pei Qi Chen Run Hu Xiaobing Luo

作者单位: School of Energy and Power Engineering Huazhong University of Science and Technology,Wuhan,Hubei 430074,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1433-1436

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）