Analysis of the failure of power amplifier caused by tining

摘要：

　　Visual inspection of the failed power amplifier revealed that an abnormal material was generated at the inductor in the amplifier circuit.Scanning Electron Microscope(SEM)and Energy Disperse Spectroscopy(EDS)were used to detecting the surface morphology and the internal composition.The analysis results show that the Abnormal substances was CuS and the copper wire near the abnormal part had a different degree of damage.Combined with microscopic analysis and amplifier experiment process,we found out the cause of failure and gave some measures to figure this problem out.

关键词： amplifier failure copper wire abnormal substances

作者: Tao Hong Yongda Hu Shengxiang Bao Chuan Luo Qiang Li Libo Ai Pengbo Jiang Jie Chen Zongzhi Duan

作者单位: School of Electronic Science and Engineering,University of Electronic Science and Technology of Chin Department of Microwave Circuit&System Institue,Chengdu Yaguang Electronics Co.Ltd Chengdu,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1507-1510

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）