The Research of Application Reliability and Failure Modes of Wire Bonding Process

摘要：

　　Gold wire bonding is one of the key technologies in high-reliability packaging process,and widely used in electronic components required high reliability.This paper studied the typical process and reliability control methods of gold wire bonding,analyzed the effect of parameters such as bond power,bond time and bond force on bonding quality,and then further studied the typical failure modes and failure causes such as cracks in the neck,pad corrosion,bond pits and purple plague.

关键词： Wire bonding Reliability Failure modes failure modes

作者: Min Kang Di Liu Yan-yan Ma He-ran Zhao Jing-yang Li Qing-chuan Liu

作者单位: Packaging & Test Division Northeast Microelectroics Institute Shenyang,China Military product Division Northeast Microelectroics Institute Shenyang,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1542-1545

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）