A new multi-layer AiP solution based on organic substrate

摘要：

　　This work proposes a low-cost Antenna-in-Packaging(AiP)solution based on organic substrate for 80GHz radar application.Redistribution layer(RDL)technology is used to attach antenna to RFIC for high-precision interconnection and system level assembly.The RFIC is embedded in organic substrate.Within this single package,the antenna element,antenne feedline and I/Os of low-speed and high-speed signals are integrated in a vertical three layer structure.The antenna system is compose of 5 patches,driven by coaxial line,which operate at 80GHz with gain of 7.79dB,bandwidth of 3.4%and S11 of-21dB.The overall footprint of the proposed AiP is 5 mm× 4 mm× 0.45 mm and the whole design can be brought into 80GHz radar applications and other mmW AiP applications.

关键词： AiP millimeter wave patch antenna organic substrate

作者: Shengjuan Zhou Qian Wang Xuesong Zhang Jian Cai Yu Chen

作者单位: School of Material Science and Engineering,Beijing Institute of Technology Beijing,P.R.China Department of Microelectronics and Nanoelectronics,Tsinghua University Beijing,P.R.China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1554-1557

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）