High Power Module Package Mounting and Temperature Cycling Reliability Study by Simulation
This paper studies the reliability of high power module package in torque mounting assembly process and temperature cycling reliability by simulation.The power module package,which with initial warpage,will be mounted on an outer heat sink with torque first and follow by in temperature cycling test.A complicated 3D non-linear finite element model was developed to simulate these two processes together.The package warpage and die stress/strain are discussed and analyzed to evaluate the die crack risk in customers application.A warpage simulation was run firstly to get the packages initial status before torque mounting.Secondly the package with initial warpage is mounted on an outer heatsink with two screws at package two edges.Small pre-tightening torque and big final tightening torque are applied on two screws step by step.Finally,the temperature cycling loading is applied on the package together with the torque mounting loading.Silicon die stress/strain are studied to evaluate the die crack risk in customers application.The actual measured warpage data at room temperature is correlated with the simulation results.Finally,the models with different package warpages and different final-tightening torques at screws were investigated to increase the reliability performance of this power module package.
Power Module Torque Mount TMCL die crack
Richard Qian Alex Yao Bruce Xu Yong Liu CH Chew
R & D Engineering ON Semiconductor,Suzhou,China R & D Engineering ON Semiconductor,Shenzhen,China Field Sales Department ON Semiconductor,Phoenix,USA R & D Engineering ON Semiconductor,South Portland,USA R & D Engineering ON Semiconductor,Seremban,Malaysia
国际会议
上海
英文
1578-1584
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）