会议专题

Application of worst case analysis to failure analysis of hybrid IC

  the root cause of component failure is usually due to manufacturing defects or external overstress,but there is a situation in hybrid IC which is cannot find the corresponding manufacturing defect or overstress when it failure,this kind of failure is often because of the system of the hybrid IC triggered the worst working condition when it running.When the electrical parameters of the components in the hybrid IC run into a worst combination by coincidence,it will lead to some components in system stress than their own abilities which they can afford,then the failure happened,that is to say,system of hybrid IC goes into worst case working conditions.Therefore,when the failure case shows randomness or elusive,we should fully consider the possible of the worst working conditions in system.This paper detailed introduction the worst case analysis(WCA)applied through a failure analysis case of a hybrid IC.

worst case analysis hybrid IC failure analysis

Tong Wang Xu Wang Meng Meng Zhimin Ding Ming He

China Aerospace Components Engineering Center Beijing,China

国际会议

第十九届国际电子封装技术会议(ICEPT 2018)

上海

英文

1585-1587

2018-08-08(万方平台首次上网日期,不代表论文的发表时间)