Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
A light-weight,robust and highly thermal conductive copper/graphene film laminated structure was developed as novel heat spreading materials for thermal management applications.The advantages of the copper/graphene film laminated structure lie in its ability to combine both good mechanical properties of metals and excellent thermal properties of graphene film.Graphene films(GFs)were fabricated via self-assembly of graphene oxide(GO)sheets and post-treated by high temperature graphitization and mechanical pressing.The resulted GFs show excellent flexibility and greatly improved tensile strength which is over 3 times higher than commercial PGS.The successful lamination between copper and GFs was realized by indium bonding.Thin indium layers can provide complete physical contact between copper and GFs,and thereby,minimize the contact resistance induced by surface roughness.The measured contact thermal resistance between copper and GFs bonded by indium is in the range of 2-5 Kmm2/W for a working temperature between 20 ℃ to 100℃.This value is orders magnitude lower than other bonding methods,including direct hot pressing of copper and GFs,tape bonding and thermal conductive adhesive(TCA)bonding.By tailoring the thickness of GFs,desirable laminated composites with optimized thermal conductivity can be obtained,which offers an efficient heat dissipation solution for power driven systems.
Graphene film Lamination Light-weight Thermal resistance
Nan Wang Shujing Chen Amos Nkansah Christian Chandra Darmawan Lilei Ye Johan Liu
SHT Smart High Tech AB G(o)teborg,Sweden SMIT Center,School of Automation and Mechanical Engineering Shanghai University Shanghai,China Department of Microtechnology and Nanoscience Chalmers University of Technology G(o)teborg,Sweden &S
国际会议
上海
英文
1588-1592
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）