Modeling,Analysis and Implementation of Junction-to-Case Thermal Resistance Measurement for Press-Pack IGBT Modules
Press-Pack IGBT modules are becoming increasingly attractive in many applications due to its device structure and short-circuit failure mode.Junction-to-Case thermal resistance(Rthjc)of Press-Pack modules is of great importance for power converter and cooling design,as well as reliability assessment.However,it is challenging to accurately achieve Rthjc of Press-Pack modules due to the Press-Pack device structure.This paper presents an accurate Rthjc measurement for Press-Pack modules based on the Transient Dual Interface Measurement(TDIM)method.The key to success of accurately measuring Rthjc of Press-Pack modules is revealed.Due to the difficulties of further decreasing the contact thermal resistance from module case to heat sink,this paper determines the Rthjc splitting point by increasing the contact thermal resistance from module case to heat sink.Analysis and modelling of the Rthjc measurement system for Press-Pack modules are presented.Finally,experimental results demonstrate the differences between the conventional methods and the method in this paper,which validates the analysis and modelling of Rthjc measurement for Press-Pack power modules.
Helong Li Yafei Wang Ashley Plumpton Yangang Wang Daohui Li Xiaoping Dai Guoyou Liu
Dynex Semiconductor Ltd Lincoln,UK State Key Laboratory of Advanced Power Semiconductor Devices Zhuzhou,China
国际会议
上海
英文
1605-1610
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）