STUDY ON DE-EMBEDDING APPROACH OF NON-COAXIAL MICROWAVE DEVICE TEST FIXTURES

摘要：

　　With the development of mobile communication technologies,the application of 5G key technologies such as large-scale antennas,full-spectrum access,and high-frequency millimeter waves will drive the RF devices to be synchronously upgraded,and the packaging of RF devices is getting smaller and smaller.How to accurately test RF devices Performance parameters become more and more difficult.It must design test fixtures for RF devices to accurately test the performance parameters of RF devices.This article uses the powerful modeling and computational capabilities of HFSS(High Frequency Structure Simulator)to design non-coaxial microwave test fixtures and calibration devices.To study the EMC characteristics of the fixture and to optimize the fixture structure,the TRL(Thru-Reflect-Line)calibration method is used to correct the system error introduced by the test fixture during testing of the microwave device so as to obtain the accurate S parameter of the microwave device.At last,the TRL calibration algorithm is compiled by Matlab to test the verification pieces,through the verification test pieces show that,the S11 in the calibration result is small,both below-20 dB,indicating that there is almost no signal reflection; S21 is close to 0,indicating that there is almost no signal insertion loss.The designed test fixtures and fixture calibration pieces allow accurate and rapid testing of non-coaxial RF devices.

关键词： TRL Algorithm S Parameter RF device testing

作者: Shouhong Chen Ping Yang Jun Ma Zhuang Wang Xuelong Yan

作者单位: Laboratory of Advanced Design,Manufacturing & Reliability for MEMS/NEMS/ODES School of Mechanical En Laboratory of Advanced Design,Manufacturing & Reliability for MEMS/NEMS/ODES School of Mechanical En School of Electronic Engineering and Automation,Guangxi Key Laboratory of Automatic Detecting Techno School of Electronic Engineering and Automation,Guilin University of Electronic Technology Guilin,Ch

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1666-1670

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）