Influence Factor Analysis of Thermal Resistance for Plastic Package

摘要：

　　The basic concept of thermal resistance for package and the principle of thermal measurement method— electrical test method are introduced.From the view of package structure and material,the thermal resistance for different groups of actual devices are tested or simulated,then the influence factors of thermal resistance for plastic package are compared and analyzed respectively.It will provide direction for the thermal resistance analysis and heat dissipation optimization for the electronic package.

关键词： thermal resistance plastic package structure thermal conductivity

作者: Wenhua Hu Jian Xu Peng Sun

作者单位: The National Center for Advanced Packaging(NCAP China)Wuxi City,Jiangsu Province,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1687-1691

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）