Development on Super-thin & High-Pixel CMOS Image Sensor Module

摘要：

　　This paper systematically reports the development on super-thin and high-pixel CMOS image sensor(CIS)module in terms of substrate design,process development,materials selection and reliability test.The as-developed super-thin chip scale package(SCSP)can greatly reduce the CIS module thickness up to 0.4 mm without sacrificing its reliability.

关键词： CMOS image sensor CIS module Super-thin chip scale package

作者: Mark Huang Huisheng Han Huabin Wu Chuangwen Huang Weiqing Zhang

作者单位: A-Kelon(Huizhou)Optronic Co.,Ltd.Huizhou of Guangdong,CHINA

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1716-1719

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）