Case Study of Resistor Failure Caused by Bi Migration and Preventive Measures

摘要：

　　In this paper,a case in which Bi migration leads to the failure of the chip resistor was analyzed,the source of Bi has been studied,and the analysis process of failure mode and failure mechanism were summarized.Migration of reduced isolation constituents(MRIC)model was described briefly.The preventive measures of the corresponding failure modes were also suggested in this paper.

关键词： electrochemical migration metal oxides chip resistor Bi

作者: Jintao Chen Liyuan Liu Fuyao Mo Binruo Zhu Yin Zhang Zhen Gu

作者单位: Electric Power Research Institute SMEPC Shanghai,China Reliability Research and Analysis Center China CEPREI Laboratory Guangzhou,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1720-1722

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）