Research of inkjet printing process for flexible electronic interconnect structures
Inkjet printing is known as a main technology to manufacture flexible electronic interconnect structures due to its ability to print different types of inks on flexible substrate in a controllable and fast way.However,current inkjet printing processes on manufacturing flexible electronic interconnects still face many challenges(e.g.fracture,rough etc.).In view these serious problems,the following research has been carried out in this paper.First of all,printed a series of single ink drop array on the flexible substrate,and measured its average diameter to select the appropriate distance spacing.Second,manufactured flexible interconnect structures with different substrate-ink groups by inkjet printing.Third,made a compare on the effect with different pre-treatment of the flexible substrate.And finally,discussed the effect on surface topography and resistivity of interconnect structures with different layers,curing temperature and time.After all above experiments,we obtained flexible interconnects with uniform surface morphology and good electrical conductivity.
flexible electronics inkjet printing Silver conductive ink Pretreatment Sintering
Siming Gong Kailin Pan Wenhui Wang KaiFan HaoCheng ChenGuo
School of Mechanical and Electrical and Engineering Guilin University of Electronic Technology Guilin,China
国际会议
上海
英文
1728-1734
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）