会议专题

A Highly Integrated Multi-parameters RF Transceiver Module for Microwave Semiconductor Chip Testing

  Microwave semiconductor chip test is currently a hot spot.The miniaturized and highly integrated RF(Radio Frequency)modules are designed to test microwave semiconductor chip.According to the design concept of synthetic instrument which owns an open architecture with standard bus and software defined radio,it uses the integrated RF channel technology to realize a variety of RF testing functions.It provides a small and highly integrated common hardware platform and flexible secondary development of software platform.This platform is highly integrated with vector signal generation,vector signal analysis,vector network analysis and noise figure analysis,which can achieve a variety of functional test through dynamic reconfiguration and real-time loading.Multi-stage switch and coupler network is used to route the reference signal and reflected signal and transmission signal for vector network analysis.The module can receive and generate signal with frequency covered 100k~18GHz.It shares baseband FPGA which make the received signal real time playback to generated channel.The bandwidth can reach 500MHz and it supports a variety of vector modulated standard.This module can be used to build testing system perfectly for microwave semiconductor chip.

Guangshan Zhang Miao Song Rongbin Guo Yahai Wang Lei Liu Jie Yang Shichao Liu Yisheng Yang

The 41st Research Institute of CETC.98 XiangJiang Road,QingDao,CHN 266555 College of Arts,China University of Petroleum(East China).66 ChangJiang West Road,Qingdao,CHN 266555

国际会议

16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors (第十六届中国国际半导体照明论坛暨2019国际第三代半导体论坛)

深圳

英文

88-92

2019-11-25(万方平台首次上网日期,不代表论文的发表时间)