A Research on Transient Thermal Resistance Test Method of IPM Module

摘要：

　　IPM modules are currently widely used in household appliances and industrial production.However,since the thermal problem caused by power loss affects the performance of the device,it is crucial to obtain the thermal resistance of the IPM module.In this paper,a thermal resistance definition method based on transient process is proposed to test the thermal resistance of IPM module.The saturation voltage drop of IGBT chip is selected as the temperature sensitivity parameter to calculate the junction temperature.Using the relationship between the saturation voltage drop and the junction temperature under a small current,the saturation voltage drop of the IGBT chip in the IPM is collected in real time,and the junction temperature curve and the transient thermal resistance are obtained.

关键词： IPM Module thermal resistance the saturation voltage drop

作者: Hui Wei Dafang Wang

作者单位: School of Automotive Engineering,Harbin Institute of Technology at Weihai,Weihai 264200,China

会议类型: 国际会议

会议名称: 2019 4th International Conference on Automatic Control and Mechatronic Engineering (ACME 2019) 2019年第四届自动控制与机电工程国际会议(ACME 2019)

会议地点: 重庆

会议语种:英文

页码: 218-222

在线出版日期: 2019-05-30（万方平台首次上网日期，不代表论文的发表时间）