High-Performance Epoxy-Based Composites as Underfill Materials for Electronic Packaging

摘要：

Yiu-Wing Mai received his undergraduate and postgraduate degrees in mechanical engineering at the University of Hong Kong.He had worked at various times in the US (the University of Michigan and the NIST),the UK (Imperial College) and Hong Kong (CityU,HKU,HKUST and PolyU).

作者: Yiu-Wing Mai

作者单位: University of Sydney,Australia

会议类型: 国际会议

会议名称: The 7th International Conference on Smart Materials and Nanotechnology in Engineering (第7届智能材料与纳米技术国际会议)

会议地点: 哈尔滨

会议语种:英文

页码: 23-23

在线出版日期: 2019-09-20（万方平台首次上网日期，不代表论文的发表时间）