Behavior of Thermal Stress Oscillation in a Functionally Graded Piezoelectric Thin Film
This study deals with dynamic electro-thermo-elastic behavior of a functionally graded piezoelectric (FGP) thin film subjected to a uniform temperature rise on the bottom surface as well as to a prescribed applied voltage between both surfaces.It is then assumed that the bottom surface of the FGP thin film is free of stress, while the top surface is fixed to a fiat rigid body.This problem is analyzed mathematically by employing techniques of the space variable transformation and Laplace transform.An exact analytical solution is derived on the assumption that nonhomogeneous material properties vary exponentially in the thickness direction.Numerical calculations have been carried out for a case where the material at the top surface of the FGP thin film is taken to be PZT-4.The effect of the applied voltage on the time history of dynamic thermal stress is investigated.
Thermal stress oscillation Functionally graded piezoelectric material Thin film Analytical solution
Fumihiro ASHIDA Takuya MORIMOTO Shoji KATSUBE
Department of Mechanical, Electrical, and Electronic Engineering, Shimane University, Matsue 690-850 Interdisciplinary Graduate School of Science and Engineering, Shimane University, Matsue 690-8504, J
国际会议
12th International Congress onThermal Stresses (第十二届国际热应力大会)
杭州
英文
188-191
2019-06-01（万方平台首次上网日期，不代表论文的发表时间）