Effect of Molding Pressure on Thermal Conductivity and Pore Size of Fumed Silica Based Insulating Composites

摘要：

　　In order to study the influence of molding pressure(0.08-5.00MPa)on the thermal conductivity and pore size of fumed silica based insulating composites prepared by dry molding technology,fumed silica powder was used as a matrix material and fiber was used as reinforcing material.The result showed that with the increase of molding pressure,the thermal conductivity of the composites decreases firstly and then increases.When the molding pressure is 0.1 MPa,the thermal conductivity of the composites has the lowest at different temperatures.With the change of molding pressure,the three-stage pore structures inside the composites are gradually destroyed.When the molding pressure is 0.1 MPa,the volume ratio of the pore size of less than 50 nm is about 80%,which can effectively restrain the convective heat transfer of gas molecules.

关键词： fumed silica thermal insulating composites molding pressure thermal conductivity pore size

作者: WANG Shijie LV Guiying CHEN Kaiyang WANG Bin GONG Zhiwei ZHAN Xuewu MA Chengliang

作者单位: High Temperature Ceramics Institute, Zhengzhou University;Henan Key Laboratory of High Temperature Functional Ceramics, Zhengzhou 450052

会议类型: 国际会议

会议名称: Conference on Refractories International 2018, CRI2018)(2018国际耐火材料学术会议)

会议地点: 杭州

会议语种:英文

页码: 1-6

在线出版日期: 2018-10-17（万方平台首次上网日期，不代表论文的发表时间）