Solution for the Drift Problem of the Chip in the Packaging Process
This paper analyzes the drift phenomenon of the chips appearing in the packaging process of the fast recovery diode(FRD),and proposes an effective process to solve this problem.In order to improve the t rade-off characteristics of fast recovery diodes,lifetime control methods,such as electron irradiation,high-e nergy ion implantation and so on,are often introduced in the chip manufacturing process.The chips describ ed in this paper use the lifetime control method of electron irradiation.The problem of chips drift during the packaging process has been found.In this paper,by comparing different back metal schemes,comparing an d analyzing the products of different manufacturers,the cause of chips drift is ultimately located in the anne aling process after electron irradiation.The result of this paper shows that the chips drift phenomenon can b e solved by adjusting the process steps.
Shaohua Dong Yueyang Liu Rui Jin Guoqing Leng Feng He Jiang Liu Yan Pan Junmin Wu
State Key Lab of Advanced Power Transmission Technology,Global Energy Interconnection Research Institute,Beijing,102209,China
国际会议
上海
英文
1-4
2018-10-12（万方平台首次上网日期，不代表论文的发表时间）