Investigation on Microstructures and Properties of W-Cu by Extrusion Molding-infiltration Sintering

摘要：

　　W-Cu alloy of the higher thermal conductivity and lower thermal expansion is widely used as electrical packaging materials and heat sink materials.W-Cu alloy was prepared by extrusion molding-infiltration sintering.The parameters such as powder loading,hot degreasing temperature and sintering temperature and time affect the formability and structure property of W-Cu alloy.The effects of infiltration sintering temperature and time on the properties and microstructures were studied.The results indicate that high properties of W-30%Cu alloy with a relative density of 99.6%and an electrical conductivity of 49%IACS are obtained when sintering at 1300℃ for 2 hours and powder loading up to 60%.

关键词： powder metallurgy W-Cu alloy extrusion molding infiltration sintering

作者: Han Shengli Liu Xin Cui Liqun Hu Ke

作者单位: Guangdong Institute of Materials and Processing,Guangdong Academy of Sciences,Guangzhou 510650,Guangdong,China;National Engineering Research Center of Powder Metallurgy of Titanium & Rare Metals,Guangzhou 510650,Guangdong,China

会议类型: 国际会议

会议名称: 2018世界粉末冶金大会

会议地点: 北京

会议语种:英文

页码: 883-888

在线出版日期: 2018-09-16（万方平台首次上网日期，不代表论文的发表时间）