A Study of Residual Stress in Rolled Copper before and after Heat Treatment

摘要：

　　The Electronic Speckle Pattern Interferometry(ESPI)-blind hole method was used to measure and characterize the residual stress in cold-rolled pure copper specimens.The initial stress field of the rolled specimen was obtained.Thenthe specimen was annealed at different temperatures(200℃,300℃,400℃ and 600℃)and the stress distribution in the depth direction was measured.The comparison of the residual stress before and after the heat treatment indicates that a higher annealing temperature led to a lower stress extent.The residual stress in the depth direction wasdecreased by about 75%,from about 150 MPa to 40 MPa when the annealing temperature was 6000C.The stress relaxation process is rationalized by observing the metallographic microstructure.This study provides a guide to the determination of heat treatment parameters.

关键词： ESPI blind hole method residual stress heat treatment

作者: Feng Heng Bai Qian Dong Xinghan

作者单位: Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024,China

会议类型: 国际会议

会议名称: 第十七届国际制造会议(The 17th International Manufacturing Conference in China)(IMCC 2017))

会议地点: 深圳

会议语种:英文

页码: 1-6

在线出版日期: 2017-11-23（万方平台首次上网日期，不代表论文的发表时间）