A Study on the Flatness Analysis of Hot Press Laminating for PCB/FPCB Manufacturing
In order to form various types of circuit patterns in the PCB/FPCB manufacturing process,it is essential to press dry film resist(DFR),which is a photosensitive material for pattern formation,and PCB panel,which is a substrate,to apply heat and uniform adhesion.In the laminating process,the difference in flatness depending on the thickness of the DFR changes the resistance value formed on the product,thereby affecting the quality.In order to solve this problem,a hot press forming process is used to apply uniform heating and adhesion,simultaneously.The thickness of the DFR have to be constantly formed through the hot press process,so that the pattern of the circuit formed on the product can be kept constant at all times.In this paper,we investigate the reliability of the process by checking the deformation on the pressurized surface through the static analysis of hot press.
Hwahyun Jeon Hyungyu Roh Youngho Jeon Moon G.Lee
Department of Mechanical Engineering,Ajou University,South Korea
国际会议
第十七届国际制造会议(The 17th International Manufacturing Conference in China)(IMCC 2017))
深圳
英文
1-1
2017-11-23（万方平台首次上网日期，不代表论文的发表时间）