3D Stack Method for Micro-PNT Based on TSV Technology

摘要：

　　On the benefit of the deeply development of MEMS and inertial instrument technology,the novel micro technology for positioning,navigation and timing(μPNT)becomes the substitution of GPS technology,and is the one of the most popular research area.The μPNT unit volume can be pressed obviously by employing 3D stack technology after MEMS components are finished,and through silicon vias(TSV)technology connects the pins inside the stack with outside ones.3D stack and TSV technology improves the reliability and high G-shock survival ability of μPNT unit.The silicon on glass(SOG)style is one of the most common structure for MEMS sensor,and the special TSV technology aimed at SOG is researched in this paper to support the SOG structure based μPNT unit.

关键词： Micro PNT TSV Micro-scale integration 3D Stack

作者: Xiaomin Duan Huiliang Cao Zhiyu Liu

作者单位: School of Electronic Engineering,University of Electronic Science and Technology of China,Chengdu,Ch Science and Technology on Electronic Test and Measurement Laboratory,North University of China,Taiyu School of Instrument and Electronic,North University of China,Taiyuan,China

会议类型: 国际会议

会议名称: 2017 IEEE 3rd Information Technology and Mechatronics Engineering Conference(ITOEC2017)(2017 IEEE 第3届信息技术与机电一体化工程国际学术会议)

会议地点: 重庆

会议语种:英文

页码: 172-175

在线出版日期: 2017-10-03（万方平台首次上网日期，不代表论文的发表时间）